AlumiChill™ OEM Grade Thermal Compound (Gen 4) Advanced Metallic-Ceramic Hybrid TIM for High-Demand Thermal Applications

AlumiChill™ represents the latest evolution in thermal interface material engineering from Elemental Dynamics. Rebuilt from the ground up, this next-generation formulation integrates a newly refined, ultra-stable base oil system with our proprietary Metallic-Ceramic Fusion Layer (MCFL)™ architecture—an engineered hybrid structure that unifies metallic conductivity pathways with micro-scale ceramic dispersants for exceptional thermal stability, flow characteristics, and long-term reliability.

Designed for both consumer and industrial electronics, AlumiChill™ excels in scenarios where consistent heat transfer is critical: high-output CPUs, GPUs, embedded systems, power electronics, and compact thermal assemblies. The dual-phase MCFL™ system improves interface uniformity while enhancing the compound’s ability to resist pumping, separation, and viscosity collapse under long-duration thermal cycling.

At its core, AlumiChill™ remains an aluminum-based TIM, but the addition of ceramic elements strategically dispersed throughout the formulation reinforces the compound’s thermodynamic performance profile. This metallic-ceramic synergy increases effective contact area, stabilizes the compound under temperature and pressure variations, and provides a more predictable performance curve over time compared to conventional pastes.

Manufactured in the USA under strict quality controls and fully compliant with RoHS and REACH standards, AlumiChill™ is engineered to provide a safe, reliable, and application-friendly thermal solution. The compound spreads smoothly across surfaces without excessive pressure, enabling consistent film thickness and uniform wetting—ensuring optimal thermal coupling even in high-tolerance environments.

Technical Advantages

• MCFL™ Hybrid Conduction Technology

A proprietary metallic-ceramic matrix designed to enhance thermal uniformity, reduce micro-void formation, and stabilize the paste under repeated thermal load cycles.

• Upgraded Base Oil System

A next-generation, thermally stable synthetic base engineered to resist shear thinning, phase separation, and high-temperature volatility, improving lifespan and overall handling.

• High Structural Stability Under Pressure

Engineered to tolerate long-term clamping forces in CPUs, GPUs, and high-density heat spreader assemblies without pump-out or compound migration.

• Precision-Tuned Rheology

A balanced viscosity profile allows easy application while maintaining structural integrity, ensuring optimal film thickness and reliable surface wetting.

• Non-Conductive & Hardware-Safe

Fully dielectric formulation eliminates the risk of electrical shorts during application, particularly in sensitive microelectronic environments.

• Advanced Metal-Based Heat Transfer

A refined aluminum particulate structure provides efficient lateral heat dissipation and consistent thermal transfer under both burst and sustained loads.

Specifications

• Specific Gravity: 2.1 g/cm³

• Base Chemistry: Synthetic hydrocarbon system with MCFL™ metallic-ceramic composite

• Primary Fillers: Aluminum-metal particulate with integrated ceramic stabilizers

• Electrical Conductivity: Non-conductive

• Thermal Behavior: High temperature resistance with stable rheological characteristics

• Handling: Smooth, uniform spreadability

• Compliance: RoHS & REACH Compliant

• Manufacturing Origin: Made in the USA

Performance Class & Comparisons

AlumiChill™ performs competitively against leading premium TIMs, including:

• Noctua NT-H1 – Comparable long-term stability with improved structural integrity

• Arctic MX-6 – Similar spreadability with enhanced metallic-ceramic conduction pathways

• Honeywell PTM7950 – Competitive stability profile, with more user-friendly repeat application characteristics

Application Use-Cases

• Desktop & mobile CPU repastes

• GPU die and memory modules

• High-density server node thermal blocks

• Embedded devices with limited airflow

• VRMs, power electronics, and MOSFET cooling

• Laptop ultrathin chassis heat spreader assemblies

• High-cycle test bench environments