{"product_id":"carbon-black™-v2g™-high-density-thermal-gap-filler-gel","title":"Carbon Black™ V2G™ High-Density Thermal Gap Filler Gel","description":"\u003cp data-start=\"218\" data-end=\"290\"\u003e\u003cem\u003eMacBook®, iPhone®, and iPad® are registered trademarks of Apple®, Inc.\u003c\/em\u003e\u003c\/p\u003e\n\u003cp data-start=\"391\" data-end=\"631\"\u003eCarbon Black™ V2G™ is a high-density thermally conductive dispensable gel engineered specifically to replace Apple’s proprietary black thermal interface material used across a wide range of MacBook, iPhone, iPad, and embedded Apple systems.\u003c\/p\u003e\n\u003cp data-start=\"633\" data-end=\"1096\"\u003eModern Apple devices frequently utilize a gap-filling thermal compound rather than traditional thin thermal paste. These interfaces often feature large bond-line thicknesses and require a dense, highly conformable material capable of maintaining consistent contact across uneven surfaces. Carbon Black™ V2G™ is formulated to meet these requirements, providing reliable heat transfer where conventional greases fail and pads introduce excessive thermal resistance.\u003c\/p\u003e\n\u003cp data-start=\"1098\" data-end=\"1391\"\u003eThe formulation utilizes a multi-modal spherical aluminum oxide particle architecture combined with secondary thermally conductive fillers to achieve greater than 90% solid loading by weight, producing a dense thermal pathway while maintaining the compliance required for large-gap interfaces.\u003c\/p\u003e\n\u003cp data-start=\"1393\" data-end=\"1705\"\u003eA carbon-enhanced cross-linked silicone gel matrix provides structural stability under compression and minimizes material migration during thermal cycling. This enables Carbon Black™ V2G™ to maintain consistent interface integrity over time, even in devices subject to repeated thermal expansion and contraction.\u003c\/p\u003e\n\u003cp data-start=\"1707\" data-end=\"1882\"\u003eCarbon Black™ V2G™ is electrically insulating and chemically stable, making it suitable for use around exposed components, fine-pitch circuitry, and high-density logic boards.\u003c\/p\u003e\n\u003ch3 data-section-id=\"1bi8ny8\" data-start=\"1889\" data-end=\"1923\"\u003eImportant Application Notice\u003c\/h3\u003e\n\u003cp data-start=\"1924\" data-end=\"1974\"\u003eThis material is not intended for universal use.\u003c\/p\u003e\n\u003cp data-start=\"1976\" data-end=\"2213\"\u003eCarbon Black™ V2G™ is specifically engineered for devices that utilize Apple’s proprietary black gap-filler thermal compound. These systems are designed with larger interface gaps that require a high-viscosity, particle-dense material.\u003c\/p\u003e\n\u003cp data-start=\"2215\" data-end=\"2356\"\u003eUse on devices with thin bond-lines (standard CPU\/GPU paste applications) is not recommended and may result in reduced thermal performance.\u003c\/p\u003e\n\u003ch3 data-section-id=\"15w0pur\" data-start=\"206\" data-end=\"248\"\u003eCompatible Devices \u003c\/h3\u003e\n\u003cp data-start=\"250\" data-end=\"381\"\u003eCarbon Black™ V2G™ is designed for Apple devices known to utilize gap-filling thermal gel interfaces, including but not limited to:\u003c\/p\u003e\n\u003cp data-start=\"383\" data-end=\"513\"\u003e\u003cstrong data-start=\"383\" data-end=\"407\"\u003eIntel-Based MacBooks\u003c\/strong\u003e\u003cbr data-start=\"407\" data-end=\"410\"\u003eA1534 (2015–2017 12\" Retina MacBook)\u003cbr data-start=\"446\" data-end=\"449\"\u003eA1932 (2018–2019 MacBook Air)\u003cbr data-start=\"478\" data-end=\"481\"\u003eA2179 (2020 Intel MacBook Air)\u003c\/p\u003e\n\u003cp data-start=\"515\" data-end=\"947\"\u003e\u003cstrong data-start=\"515\" data-end=\"551\"\u003eApple Silicon MacBooks \u0026amp; Systems\u003c\/strong\u003e\u003cbr data-start=\"551\" data-end=\"554\"\u003eA2237 (M1 MacBook Air – memory\/SoC interface areas)\u003cbr data-start=\"605\" data-end=\"608\"\u003eA2238 (M1 MacBook Pro – memory\/SoC interface areas)\u003cbr data-start=\"659\" data-end=\"662\"\u003eA2337 (M1 MacBook Air)\u003cbr data-start=\"684\" data-end=\"687\"\u003eA2338 (M1 MacBook Pro 13\")\u003cbr data-start=\"713\" data-end=\"716\"\u003eA2442 (M1 Pro\/Max 14\" MacBook Pro)\u003cbr data-start=\"750\" data-end=\"753\"\u003eA2485 (M1 Pro\/Max 16\" MacBook Pro)\u003cbr data-start=\"787\" data-end=\"790\"\u003eA2681 (M2 MacBook Air)\u003cbr data-start=\"812\" data-end=\"815\"\u003eA2779 (M2 MacBook Pro 13\")\u003cbr data-start=\"841\" data-end=\"844\"\u003eA2780 \/ A2781 (M2 Pro\/Max MacBook Pro 14\"\/16\")\u003cbr data-start=\"890\" data-end=\"893\"\u003eA2941 \/ A2992 \/ A2991 (M3 series MacBook Pro models)\u003c\/p\u003e\n\u003cp data-start=\"949\" data-end=\"1077\"\u003e\u003cstrong data-start=\"949\" data-end=\"1007\"\u003eMacBook Air (Apple Silicon – Gap Fill Thermal Systems)\u003c\/strong\u003e\u003cbr data-start=\"1007\" data-end=\"1010\"\u003eM2 MacBook Air\u003cbr data-start=\"1024\" data-end=\"1027\"\u003eM3 MacBook Air\u003cbr data-start=\"1041\" data-end=\"1044\"\u003eM4 MacBook Air\u003cbr data-start=\"1058\" data-end=\"1061\"\u003eM5 MacBook Air\u003c\/p\u003e\n\u003cp data-start=\"1079\" data-end=\"1247\"\u003e\u003cstrong data-start=\"1079\" data-end=\"1102\"\u003eOther Apple Systems\u003c\/strong\u003e\u003cbr data-start=\"1102\" data-end=\"1105\"\u003eA2348 (M1 Mac mini – memory\/SoC interface areas)\u003cbr data-start=\"1153\" data-end=\"1156\"\u003eApple Silicon Mac mini (M2 series)\u003cbr data-start=\"1190\" data-end=\"1193\"\u003eApple Silicon Mac Studio (select gap-fill locations)\u003c\/p\u003e\n\u003cp data-start=\"1249\" data-end=\"1464\"\u003e\u003cstrong data-start=\"1249\" data-end=\"1276\"\u003eiPhone and iPad Devices\u003c\/strong\u003e\u003cbr data-start=\"1276\" data-end=\"1279\"\u003eiPhone models from iPhone 5 through present utilizing internal gap-fill thermal interfaces\u003cbr data-start=\"1369\" data-end=\"1372\"\u003eiPad models, including recent Apple Silicon iPads, utilizing gap-filling thermal compounds\u003cstrong data-start=\"1466\" data-end=\"1493\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3 data-end=\"282\" data-start=\"256\" data-section-id=\"x963at\"\u003eTypical Applications\u003c\/h3\u003e\n\u003cp data-end=\"409\" data-start=\"283\"\u003eCarbon Black™ V2G™ is intended for applications requiring controlled bond-line thickness and long-term stability, including:\u003c\/p\u003e\n\u003cp data-end=\"447\" data-start=\"411\"\u003eApple SoC memory interface regions\u003c\/p\u003e\n\u003cp data-end=\"485\" data-start=\"449\"\u003eVRMs and power delivery components\u003c\/p\u003e\n\u003cp data-end=\"526\" data-start=\"487\"\u003eSSD and controller thermal interfaces\u003c\/p\u003e\n\u003cp data-end=\"568\" data-start=\"528\"\u003eHeat spreader and heat pipe interfaces\u003c\/p\u003e\n\u003cp data-end=\"612\" data-start=\"570\"\u003eReplacement of factory black thermal gel\u003c\/p\u003e\n\u003cp data-end=\"714\" data-start=\"614\"\u003eThermal putty replacement on handheld and compact devices (including Nintendo Switch and Switch 2)\u003c\/p\u003e\n\u003cp data-end=\"869\" data-start=\"716\"\u003eThermal pad replacement on game consoles (PlayStation 4, PlayStation 5, and Xbox systems — for gap-filling interfaces only, not direct die application)\u003c\/p\u003e\n\u003ch3 data-section-id=\"1kdq25b\" data-start=\"4244\" data-end=\"4269\"\u003eKey Characteristics\u003c\/h3\u003e\n\u003cp data-start=\"4270\" data-end=\"4615\"\u003e• High-density thermal interface gel\u003cbr data-start=\"4306\" data-end=\"4309\"\u003e• Multi-modal particle packing architecture\u003cbr data-start=\"4352\" data-end=\"4355\"\u003e• Cross-linked silicone gel binder\u003cbr data-start=\"4389\" data-end=\"4392\"\u003e• Low pump-out under thermal cycling\u003cbr data-start=\"4428\" data-end=\"4431\"\u003e• Stable under vibration and mechanical stress\u003cbr data-start=\"4477\" data-end=\"4480\"\u003e• Maintains bond-line thickness over time\u003cbr data-start=\"4521\" data-end=\"4524\"\u003e• Electrically insulating\u003cbr data-start=\"4549\" data-end=\"4552\"\u003e• Easily dispensable with a controlled, high-flow consistency\u003c\/p\u003e\n\u003ch3 data-section-id=\"3xkjiv\" data-start=\"4622\" data-end=\"4647\"\u003eTypical Properties*\u003c\/h3\u003e\n\u003cp data-start=\"4648\" data-end=\"4941\"\u003e• Appearance: Black gel\u003cbr data-start=\"4671\" data-end=\"4674\"\u003e• Base Polymer: Cross-linked silicone\u003cbr data-start=\"4711\" data-end=\"4714\"\u003e• Filler System: Multi-modal aluminum oxide particle matrix\u003cbr data-start=\"4773\" data-end=\"4776\"\u003e• Solid Loading: \u0026gt;90% by weight\u003cbr data-start=\"4807\" data-end=\"4810\"\u003e• Specific Gravity: ~3.3 g\/cm³\u003cbr data-start=\"4840\" data-end=\"4843\"\u003e• Recommended Bond Line Thickness: 100–300 µm (0.10–0.30 mm)\u003cbr data-start=\"4903\" data-end=\"4906\"\u003e• Thermal Conductivity: ≥ 4 W\/m·K\u003c\/p\u003e\n\u003cp data-start=\"4943\" data-end=\"4992\"\u003e*Typical values are provided for reference only\u003c\/p\u003e\n\u003ch3 data-section-id=\"hxy4l5\" data-start=\"4999\" data-end=\"5014\"\u003ePackaging\u003c\/h3\u003e\n\u003cp data-start=\"5015\" data-end=\"5092\"\u003e10g or 40g syringe (Compatible with manual or pneumatic dispensing systems)\u003c\/p\u003e","brand":"Elemental Dynamics","offers":[{"title":"10g (Plunger Not Included)","offer_id":47330605007101,"sku":null,"price":19.99,"currency_code":"USD","in_stock":true},{"title":"40g (Plunger Not Included)","offer_id":47330605039869,"sku":null,"price":49.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0709\/0887\/0909\/files\/CarbonBlackv2g.png?v=1774727377","url":"https:\/\/elementaldynamics.io\/products\/carbon-black%e2%84%a2-v2g%e2%84%a2-high-density-thermal-gap-filler-gel","provider":"Elemental Dynamics ","version":"1.0","type":"link"}