759-ASX-V3™ No Clean Tacky Flux

Engineered as the third-generation evolution of the 759-ASX™ platform, 759-ASX-V3™ delivers refined rheology, extended thermal dwell, and enhanced control for the most demanding microsoldering and rework applications. Built on a newly optimized resin system, V3 offers a noticeably smoother, more consistent body while maintaining the strong activation and stability professionals rely on.

Developed for liquid-damaged, heavily oxidized, and high-density assemblies, 759-ASX-V3™ excels in BGA rework, CPU swaps, flip-chip processes, and advanced data-recovery operations, where predictable behavior under heat is critical.

The flux remains active throughout prolonged hot-air and iron profiles, promoting clean oxide removal and reliable solder wetting without premature burn-off. Upon cooling, it leaves a clear, soft, non-crystalline residue that simplifies inspection and does not require post-reflow cleaning under normal use.

Fully halogen-free, RoHS and REACH compliant, and formulated to meet stringent electronics-industry standards, 759-ASX-V3™ represents a significant refinement over previous generations while preserving the trusted characteristics that made 759-ASX™ a staple among professional repair technicians.

Key Characteristics

• Residue: Crystal-clear, glossy, non-corrosive (no-clean)

• Flux Type: No-clean (ROL0), halogen-free

• Rheology: Smooth, tacky, air-free formulation for precise placement

• Thermal Performance: Extended dwell time with controlled activation

• Moisture Resistance: Hydrophobic residue helps protect repaired assemblies

• Odor Profile: Industry-standard terpene system with familiar pine character

Ideal Applications

• Liquid-damaged and corrosion-affected PCBs

• CPU and SoC replacements

• BGA and flip-chip rework

• Fine-pitch and high-density microsoldering

• Data recovery and forensic electronics repair

Safety Data Sheet (SDS)

759-ASX-V3™ is universal and compatible with the following leaded and lead free alloys:

Lead-Based Solder Alloys:

• Sn63/Pb37 (63% Tin, 37% Lead) — Melting Point: 183°C
• Sn60/Pb40 (60% Tin, 40% Lead) — Melting Point: 183-190°C

Lead-Free Solder Alloys:

• SAC305 (96.5% Tin, 3.0% Silver, 0.5% Copper) — Melting Point: 217-221°C
• SAC405 (95.5% Tin, 4.0% Silver, 0.5% Copper) — Melting Point: 217-221°C
• Sn100C (99.3% Tin, 0.7% Copper) — Melting Point: 227°C

High-Temperature Lead-Free Alloys:

• Sn95/Ag5 (95% Tin, 5% Silver) — Melting Point: 221-245°C

Low-Temperature Lead-Free Alloys:

• Sn42/Bi58 (42% Tin, 58% Bismuth) — Melting Point: 138°C