AquaFlow™ ORH-Zero™ High Activity Water-Soluable Flux

The Ultimate Standard for Maximum Oxide Removal and Precision Water-Washable Assembly.

Description: Engineered for extreme performance, AquaFlow ORH-Zero™ bridges the gap between the raw activation power needed to recover heavily oxidized assemblies and the pristine cleanliness required for high-reliability manufacturing. Built on an advanced, halogen-free organic (OR) carrier system, ORH-Zero delivers a remarkably smooth, air-free consistency for precise syringe dispensing. To ensure rigorous Quality Assurance, this formulation features an integrated, UV-fluorescent green dye. Under normal light, it provides excellent visual contrast during application, and under a 365nm blacklight, it glows brilliantly—enabling rapid, definitive visual validation of complete residue removal after washing.

Whether you are stripping heavily tarnished pads, dragging solder across fine-pitch ICs, or profiling high-mass components, AquaFlow ORH-Zero™ provides aggressive de-oxidation and highly predictable behavior under heat. Its proprietary carrier matrix features an exceptional thermal dwell that survives prolonged hot-air profiles, promoting rapid, flawless solder wetting without the violent spatter or premature burn-off common to standard water-soluble fluxes.

Due to its high-activity organic formulation, AquaFlow ORH-Zero™ must be thoroughly cleaned after use. Post-reflow residues dissolve instantly and completely when washed with 60°C (140°F) hot DI water at 40-60 PSI. Alternatively, it can be easily removed in an ultrasonic cleaner operating at 50°C to 70°C (122°F-158°F) using either plain DI or distilled water, or a commercially available ultrasonic cleaning solution. This ensures a pristine, zero-residue surface that is perfectly prepped for conformal coating and strict electrical testing.

Key Characteristics

• Flux Type: High-activity water-soluble (ORH0), completely Halogen-Free, Rosin/Resin-Free, RoHS & REACH compliant.

• Rheology: Smooth, high-tack gel formulation for precise component placement and shift-free retention.

• Thermal Performance: High-temperature survival with extended dwell; highly resistant to spatter and premature burn-off.

• Residue & Inspection: Dyed fluorescent green with a brilliant UV-reactive tracer for rapid, 100% verified wash inspection.

• Mandatory Wash Profile: Must be cleaned post-use. Highly soluble in 60°C DI water (40-60 PSI) or 50°C-70°C ultrasonic baths (plain DI/distilled water or commercial cleaning solutions).

• Odor Profile: Near Odorless 

Ideal Applications For Production & OEM Assembly:

• High-mass component soldering, heavy ground planes, and wave/reflow processing.

• Assemblies requiring absolutely zero post-wash residue for conformal coating.

• Automated or manual QA lines utilizing UV blacklight wash-validation.

For Advanced Rework & Repair:

• Recovery of heavily oxidized, tarnished, vintage, or liquid-damaged PCBs.

• Lead-free BGA and fine-pitch soldering requiring aggressive chemical wetting.

• Environments prioritizing rosin-free technician safety and rapid, solvent-free cleanup.

Safety Data Sheet (SDS)

AquaFlow ORH-Zero™ is universal and compatible with the following leaded and lead-free alloys:

Lead-Based Solder Alloys:

• Sn63/Pb37 (63% Tin, 37% Lead) — Melting Point: 183°C
• Sn60/Pb40 (60% Tin, 40% Lead) — Melting Point: 183-190°C

Lead-Free Solder Alloys:

• SAC305 (96.5% Tin, 3.0% Silver, 0.5% Copper) — Melting Point: 217-221°C
• SAC405 (95.5% Tin, 4.0% Silver, 0.5% Copper) — Melting Point: 217-221°C
• Sn100C (99.3% Tin, 0.7% Copper) — Melting Point: 227°C

High-Temperature Lead-Free Alloys:

• Sn95/Ag5 (95% Tin, 5% Silver) — Melting Point: 221-245°C

Low-Temperature Lead-Free Alloys:

• Sn42/Bi58 (42% Tin, 58% Bismuth) — Melting Point: 138°C