ThermaGel G330™ High Density Thermal Gap Filler Gel

ThermaGel G330™ is a high density thermally conductive dispensable gel engineered for assemblies requiring controlled bond-line thickness, mechanical stability, and reliable heat transfer across uneven or large interface gaps. 

ThermaGel G330™ is suitable for all applications requiring thermal gels, thermal putties, or thermal pads with bond-line thicknesses from 100 to 300 µm (0.10–0.30 mm).

The formulation utilizes a multi-modal spherical aluminum oxide particle architecture combined with secondary thermally conductive fillers to achieve greater than 90% solid loading by weight, producing a dense thermal pathway while maintaining the conformability required for large bond-line interfaces.

A carbon-enhanced cross-linked silicone gel matrix provides structural stability under compression and minimizes material migration during thermal cycling. This architecture enables ThermaGel G330™ to maintain consistent interface integrity in applications where traditional greases may pump-out and conventional pads may introduce excessive thermal resistance.

ThermaGel G330™ is electrically insulating and chemically stable, making it suitable for use around exposed electronic components and sensitive assemblies.

Typical Applications

ThermaGel G330™ is intended for applications requiring controlled bond-line thickness and long-term stability, including:

• CPU and GPU thermal interfaces

• Power electronics and VRM assemblies

• Memory and controller packages

• Heat pipe and heat spreader interfaces

• Embedded and industrial electronics

• Automotive ECU and module applications
  

The gel structure accommodates surface irregularities while maintaining consistent thermal contact, making it well suited for gap-filling interfaces and thermal pad replacement applications.

Key Characteristics

• High-density thermal interface gel

• Multi-modal particle packing architecture

• Cross-linked silicone gel binder

• Low pump-out under thermal cycling

• Stable under vibration and mechanical stress

• Electrically insulating

• Easily dispensable with a high flow rate 

Typical Properties*

• Appearance: Black gel

• Base Polymer: Cross-linked silicone

• Filler System: Multi-modal aluminum oxide particle matrix

• Solid Loading: >90% by weight

• Specific Gravity: ~3.3 g/cm³

• Recommended Bond Line Thickness: 100–300 µm (0.10–0.30 mm)

• Thermal Conductivity: ≥ 4 W/m·K

*Typical values are provided for reference only

Packaging: 10g or 40g syringe (Compatible with manual or pneumatic dispensing systems)