Carbon Black™ V2G™ High-Density Thermal Gap Filler Gel

MacBook®, iPhone®, and iPad® are registered trademarks of Apple®, Inc.

Carbon Black™ V2G™ is a high-density thermally conductive dispensable gel engineered specifically to replace Apple’s proprietary black thermal interface material used across a wide range of MacBook, iPhone, iPad, and embedded Apple systems.

Modern Apple devices frequently utilize a gap-filling thermal compound rather than traditional thin thermal paste. These interfaces often feature large bond-line thicknesses and require a dense, highly conformable material capable of maintaining consistent contact across uneven surfaces. Carbon Black™ V2G™ is formulated to meet these requirements, providing reliable heat transfer where conventional greases fail and pads introduce excessive thermal resistance.

The formulation utilizes a multi-modal spherical aluminum oxide particle architecture combined with secondary thermally conductive fillers to achieve greater than 90% solid loading by weight, producing a dense thermal pathway while maintaining the compliance required for large-gap interfaces.

A carbon-enhanced cross-linked silicone gel matrix provides structural stability under compression and minimizes material migration during thermal cycling. This enables Carbon Black™ V2G™ to maintain consistent interface integrity over time, even in devices subject to repeated thermal expansion and contraction.

Carbon Black™ V2G™ is electrically insulating and chemically stable, making it suitable for use around exposed components, fine-pitch circuitry, and high-density logic boards.

Important Application Notice

This material is not intended for universal use.

Carbon Black™ V2G™ is specifically engineered for devices that utilize Apple’s proprietary black gap-filler thermal compound. These systems are designed with larger interface gaps that require a high-viscosity, particle-dense material.

Use on devices with thin bond-lines (standard CPU/GPU paste applications) is not recommended and may result in reduced thermal performance.

Compatible Devices 

Carbon Black™ V2G™ is designed for Apple devices known to utilize gap-filling thermal gel interfaces, including but not limited to:

Intel-Based MacBooks
A1534 (2015–2017 12" Retina MacBook)
A1932 (2018–2019 MacBook Air)
A2179 (2020 Intel MacBook Air)

Apple Silicon MacBooks & Systems
A2237 (M1 MacBook Air – memory/SoC interface areas)
A2238 (M1 MacBook Pro – memory/SoC interface areas)
A2337 (M1 MacBook Air)
A2338 (M1 MacBook Pro 13")
A2442 (M1 Pro/Max 14" MacBook Pro)
A2485 (M1 Pro/Max 16" MacBook Pro)
A2681 (M2 MacBook Air)
A2779 (M2 MacBook Pro 13")
A2780 / A2781 (M2 Pro/Max MacBook Pro 14"/16")
A2941 / A2992 / A2991 (M3 series MacBook Pro models)

MacBook Air (Apple Silicon – Gap Fill Thermal Systems)
M2 MacBook Air
M3 MacBook Air
M4 MacBook Air
M5 MacBook Air

Other Apple Systems
A2348 (M1 Mac mini – memory/SoC interface areas)
Apple Silicon Mac mini (M2 series)
Apple Silicon Mac Studio (select gap-fill locations)

iPhone and iPad Devices
iPhone models from iPhone 5 through present utilizing internal gap-fill thermal interfaces
iPad models, including recent Apple Silicon iPads, utilizing gap-filling thermal compounds

Typical Applications

Carbon Black™ V2G™ is intended for applications requiring controlled bond-line thickness and long-term stability, including:

Apple SoC memory interface regions

VRMs and power delivery components

SSD and controller thermal interfaces

Heat spreader and heat pipe interfaces

Replacement of factory black thermal gel

Thermal putty replacement on handheld and compact devices (including Nintendo Switch and Switch 2)

Thermal pad replacement on game consoles (PlayStation 4, PlayStation 5, and Xbox systems — for gap-filling interfaces only, not direct die application)

Key Characteristics

• High-density thermal interface gel
• Multi-modal particle packing architecture
• Cross-linked silicone gel binder
• Low pump-out under thermal cycling
• Stable under vibration and mechanical stress
• Maintains bond-line thickness over time
• Electrically insulating
• Easily dispensable with a controlled, high-flow consistency

Typical Properties*

• Appearance: Black gel
• Base Polymer: Cross-linked silicone
• Filler System: Multi-modal aluminum oxide particle matrix
• Solid Loading: >90% by weight
• Specific Gravity: ~3.3 g/cm³
• Recommended Bond Line Thickness: 100–300 µm (0.10–0.30 mm)
• Thermal Conductivity: ≥ 4 W/m·K

*Typical values are provided for reference only

Packaging

10g or 40g syringe (Compatible with manual or pneumatic dispensing systems)