Elemental Dynamics
CitriFlow Eco™ 100% Plant-Based Tacky Flux Gel
Designed for demanding soldering applications, Citriflow Eco™ is a high-performance, no-clean tacky flux formulated entirely from plant-derived materials. Optimized for precision rework, BGA, and fine-pitch soldering, Citriflow Eco™ delivers consistent activation, strong oxide removal, and controlled wetting across a wide range of conditions.
As the world’s first 100% plant-based soldering flux, Citriflow Eco™ eliminates petroleum-based carriers and synthetic additives while maintaining professional-grade performance. Its extended activation profile provides a long working time, allowing for complex rework without premature burnout, while ensuring smooth solder flow and reliable joint formation.
Following reflow, Citriflow Eco™ leaves behind a thin, hard, encapsulating protective film. This residue is electrically insulating, non-corrosive, and does not require cleaning. Its exceptional transparency allows for clear post-process inspection of solder joints and pad conditions.
Fully halide-free and compliant with IEC 61249-2-21 standards, Citriflow Eco™ also meets RoHS and REACH compliance requirements.
Transparency:
Exceptionally clear residue for easy post-solder inspection
Type:
No-clean (ROL0), plant-derived rosin system, optimized for precision work
Odor:
Light natural citrus terpene fragrance
Halogen-Free:
Fully compliant with IEC 61249-2-21 standards
Hydrophobic:
Repels moisture, providing protection and long-term stability
Activation Profile:
Extended activation time for longer working window and complex rework
Residue Behavior:
Forms a hard, transparent, encapsulating protective film after reflow
Ideal Applications:
Precision PCB rework, BGA, flip chip, fine-pitch soldering, and general electronics repair
Citriflow Eco™ is universal and compatible with the following leaded and lead-free alloys:
Lead-Based Solder Alloys:
- Sn63/Pb37 (63% Tin, 37% Lead) — Melting Point: 183°C
- Sn60/Pb40 (60% Tin, 40% Lead) — Melting Point: 183–190°C
Lead-Free Solder Alloys:
- SAC305 (96.5% Tin, 3.0% Silver, 0.5% Copper) — Melting Point: 217–221°C
- SAC405 (95.5% Tin, 4.0% Silver, 0.5% Copper) — Melting Point: 217–221°C
- Sn100C (99.3% Tin, 0.7% Copper) — Melting Point: 227°C
High-Temperature Lead-Free Alloys:
- Sn95/Ag5 (95% Tin, 5% Silver) — Melting Point: 221–245°C
Low-Temperature Lead-Free Alloys:
- Sn42/Bi58 (42% Tin, 58% Bismuth) — Melting Point: 138°C
Shipping & Returns
Our fluxes and thermal interface materials are formulated and manufactured in the United States and ship directly from our production facility. Each batch is prepared and packaged with controlled handling procedures to maintain product integrity throughout transit. Please note that most formulations are manufactured to order, and depending on production volume may require a lead time of up to 10 days.
Due to the consumable and non-restockable nature of these materials, returns cannot be accepted. If any irregularities occur during shipping or if your order arrives in suboptimal condition, please contact our support team by sending an email to support@elementaldynamics.io. We will evaluate the issue and provide the most appropriate resolution based on the product and circumstances.
Manufacturing Lab Information
05: SYNT - Elemental Dynamics, 39450 3rd St E, STE 119, Palmdale, CA 93550
For Inquiries, customers may contact Lab: support@elementaldynamics.io
