759-ASX-V3™ No Clean Tacky Flux

The Flagship Standard for Precision Assembly and Advanced Rework.

• Description: Engineered as the third-generation evolution of our flagship platform, 759-ASX-V3™ bridges the gap between stringent OEM manufacturing standards and the raw activation power required for complex board repair. Built on a newly optimized resin system, V3 delivers refined rheology and a noticeably smoother, air-free consistency for highly precise dispensing. 759-ASX-V3™ is electrically insulating and will not cause voltage leakage if left on the board. 

  
  

  Whether you are profiling a high-density BGA on a factory line or recovering a heavily oxidized, liquid-damaged assembly, 759-ASX-V3™ provides predictable behavior under heat. It features an extended thermal dwell that remains active throughout prolonged reflow and hot-air profiles, promoting reliable solder wetting without premature burn-off. Post-reflow, it leaves a clear, soft, non-crystalline residue that simplifies automated inspection and requires absolutely no post-reflow cleaning.

Key Characteristics

• Flux Type: No-clean (ROL0), fully Halogen-Free, RoHS & REACH compliant.

• Rheology: Smooth, high-tack, air-free formulation for precise component placement and shift-free retention.

• Thermal Performance: Extended dwell time with controlled activation; highly resistant to burn-off.

• Residue: Crystal-clear, glossy, and non-corrosive (inspection-ready).

• Moisture Resistance: Hydrophobic residue helps protect sensitive assemblies.

• Odor Profile: Industry-standard terpene system with a familiar, mild pine character.
  

Ideal Applications

For Production & OEM Assembly:

• High-density BGA, CSP, and flip-chip automated profiling.

• Fine-pitch component placement and wave/reflow soldering.

• Mission-critical electronics assembly requiring strict "no-clean" compliance.

For Advanced Rework & Repair:

• CPU, SoC, and complex IC replacements.

• Liquid-damaged and heavily oxidized PCB recovery.

• Data recovery and forensic electronics repair.

Safety Data Sheet (SDS)

759-ASX-V3™ is universal and compatible with the following leaded and lead free alloys:

Lead-Based Solder Alloys:

• Sn63/Pb37 (63% Tin, 37% Lead) — Melting Point: 183°C
• Sn60/Pb40 (60% Tin, 40% Lead) — Melting Point: 183-190°C

Lead-Free Solder Alloys:

• SAC305 (96.5% Tin, 3.0% Silver, 0.5% Copper) — Melting Point: 217-221°C
• SAC405 (95.5% Tin, 4.0% Silver, 0.5% Copper) — Melting Point: 217-221°C
• Sn100C (99.3% Tin, 0.7% Copper) — Melting Point: 227°C

High-Temperature Lead-Free Alloys:

• Sn95/Ag5 (95% Tin, 5% Silver) — Melting Point: 221-245°C

Low-Temperature Lead-Free Alloys:

• Sn42/Bi58 (42% Tin, 58% Bismuth) — Melting Point: 138°C